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product structure silicon monolithic integrated circuit this product is not designed prot ection against radioactive rays . 1/10 tsz02201-0rbr0a300170-1-2 ? 2012 rohm co., ltd. all rights reserved. 25.sep.2013 rev.001 tsz22111 ? 14 ? 001 www.rohm.com datashee t cmos ldo regulators for portable equipments 1ch 300ma cmos ldo regulators bhxxma3 series general description bhxxma3 series are high-performance cmos ldo regulators with output current abi lity of up to 300ma. these devices have excellent noise characteristics despite of their low circuit current consumption of 65a. they are most appropriate for various applications such as power supplies for logic ic, rf, and camera modules. features ? high output voltage accuracy: 1 % ( 25mv on vout<2.5v products) ? dropout voltage: 60mv (iout=100ma) ? compatible with small ceramic capacitor ? output voltage on/off control ? built-in over current protection circuit (ocp) ? built-in thermal shutdown circuit (tsd) ? ultra-small powe r package:hvsof6 applications ? battery-driven portable devices ? other electronic devices using microcontrollers or logic circuits key specifications ? input power supply voltage range: 2.5v to 5.5v ? output current range: 0 to 300ma ? operating temperature range: -40 to 85 ? output voltage lineup: 1.5v to 3.3v ? output voltage accuracy: 1% ? circuit current: 65 a (typ.) ? standby current: 0 a (typ.) package w(typ.) x d(typ.) x h(max.) hvsof6 1.60mm x 3.00mm x 0.75mm typical application circuit figure 1. typical application circuit vin stby voutvout vin vout cout cin on off cn gnd noise vin stby voutvout vin vout cout cin on off cn gnd noise bhxxma3 downloaded from: http:///
datasheet datasheet 2/10 tsz02201-0rbr0a300170-1-2 ? 2012 rohm co., ltd. all rights reserved. 25.sep.2013 rev.001 www.rohm.com tsz22111 ? 15 ? 001 bhxxma3 series figure 2. block diagram pin configuration pin description pin no. symbol function 1 vin input pin 2 vout output pin 3 vout output pin 4 noise noise reducing capacitor ground terminal 5 gnd ground pin 6 stby output control pin (high:on,low:off) reverse fin open block diagram vout voltage reference 6 - + vin stby vout thermal protection over current protection control block 5 1 2 3 4 gnd noise vout voltage reference 6 - + vin stby vout thermal protection over current protection control block 5 5 1 1 2 2 3 3 4 4 gnd noise vin vout vout stby gnd noise downloaded from: http:///
datasheet datasheet 3/10 tsz02201-0rbr0a300170-1-2 ? 2012 rohm co., ltd. all rights reserved. 25.sep.2013 rev.001 www.rohm.com tsz22111 ? 15 ? 001 bhxxma3 series absolute maximum ratings parameter symbol ratings unit maximum power supply voltage range v max -0.3 to +6.5 v power dissipation pd 680 (*1) mw maximum junction temperature tjmax +125 operating temperature range topr -40 to +85 storage temperature range tstg -55 to +125 (*1) derate by 6.8mw/ when operating above ta=25 . (when mounted on a board 70mm 70mm 1.6mm glass-epoxy board, two layer.) recommended operating ratings parameter symbol limit unit input power supply voltage range vin 2.5 to 5.5 v maximum output current range imax 0 to 300 ma recommended operating conditions parameter symbol ratings unit conditions min. typ. max. input capacitor cin 1.0 (*2) f a ceramic capacitor is recommended. output capacitor cout 1.0 (*2) f a ceramic capacitor is recommended. noise decrease capacitor cn 0.01 0.22 f a ceramic capacitor is recommended. (*2) set the value of the capacitor so t hat it does not fall below the minimum value. take into considerations the temperature characteristics, dc device characteristics, and degradation with time. downloaded from: http:///
datasheet datasheet 4/10 tsz02201-0rbr0a300170-1-2 ? 2012 rohm co., ltd. all rights reserved. 25.sep.2013 rev.001 www.rohm.com tsz22111 ? 15 ? 001 bhxxma3 series electrical characteristics (unless otherwise noted, ta=25 ,vin=vout+1.0v (*3) ,stby=1.5v, cin=1 f, c o = 1 f, cn=0.01 f. ) parameter symbol limit unit conditions min. typ. max. reg output voltage vout vout 0.99 vout vout 1.01 v iout=1ma, vout R 2.5v vout -25mv vout vout +25mv iout=1ma, vout 2.5v circuit current ignd - 65 95 a iout=1ma circuit current (stby) istby - - 1.0 a stby=0v ripple rejection ratio r.r. - 60 - db vrr=-20dbv,frr=1khz,iout=10ma dropout voltage vsat1 - 60 90 mv vin=0.98vout,iout=100ma vout R 2.5v line regulation vdl1 - 2 20 mv iout=1ma vin=vout+0.5v to 5.5v (*4) load regulation 1 vdlo1 - 6 30 mv iout=1ma to 100ma load regulation 2 vdlo2 - 18 90 mv iout=1ma to 300ma output voltage temperature S vout/ S ta - 100 - ppm/ iout=1ma,ta=-40 to +85 ocp limit current ilmax 310 600 1300 ma vo=vout0.85 short current ishort - 100 - ma vo=0v stby stby pull-down resistor rstb 550 1100 2200 k ? stby control voltage on vstbh 1.5 - vcc v off vstbl -0.3 - 0.3 v (*3) vin=3.5v for vout 2.5v. (*4) vin=3.0v to 5.5v for vout 2.5v. downloaded from: http:///
datasheet datasheet 5/10 tsz02201-0rbr0a300170-1-2 ? 2012 rohm co., ltd. all rights reserved. 25.sep.2013 rev.001 www.rohm.com tsz22111 ? 15 ? 001 bhxxma3 series reference data bh30ma3whfv (unless otherwise specified, ta=25 .) figure 5. output voltage vs. output current (ocp threshold) figure 3. output voltage vs. input voltage figure 4. gnd current vs. input voltage figure 6. dropout voltage vs. output current downloaded from: http:///
datasheet datasheet 6/10 tsz02201-0rbr0a300170-1-2 ? 2012 rohm co., ltd. all rights reserved. 25.sep.2013 rev.001 www.rohm.com tsz22111 ? 15 ? 001 bhxxma3 series reference data bh30ma3whfv (ta=25 , unless otherwise specified.) figure 7. output voltage vs. temperature figure 8. ripple rejection vs. frequency figure 9. load response figure 10. startup time downloaded from: http:///
datasheet datasheet 7/10 tsz02201-0rbr0a300170-1-2 ? 2012 rohm co., ltd. all rights reserved. 25.sep.2013 rev.001 www.rohm.com tsz22111 ? 15 ? 001 bhxxma3 series about input/output capacitor it is recommended that an input capacitor is placed near pins between the vcc pin and gnd as well as an output capacitor between the output pin and gnd. the input is valid when the power supply impedance is high or when the pcb trace has significant length. for the output capacitor, the greater the capacitance, the more stable the output will be depending on the load and line voltage variations. however, please check the actual functionality of this capacitor by mounting it on a board for the actual application. ceramic capacitors usually have different, thermal and equivalent series resistance characteristics, and may degrade gradually over continued use. for additional details, please check with the manufacturer, and select the best ceramic capacitor for your application equivalent series resistance (esr) of a ceramic capacitor capacitors generally have esr (equivalent series resistance) and it operates stably in the esr-iout area shown on the right. since ceramic capacitors, tantalum capacito rs, electrolytic capacitors, etc. generally have different esr, please check the esr of the capacitor to be used and use it within the stability area range shown in the right graph for evaluation of t he actual application. power dissipation (pd) as for power dissipation, an estimate of heat reduction characte ristics and internal power consumption of ic are shown, so please use these for reference. since power dissipation chang es substantially depending on t he implementation conditions (board size, board thickness, metal wiring rate, number of layers and through holes, etc.), it is recommended to measure pd on a set board. exceeding the power dissipation of ic may lead to deterioration of the original ic performance, such as causing the operation of the thermal shut down circuit or reduction in current capa bility. therefore, be sure to prepare sufficient margin within power dissipation for usage. calculation of the maximum internal power consumption of ic (pmax) p max =(v in -v out )i omax where : v in =input voltage v out = output voltage i omax : maximum output current 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0 25 50 75 100 125 pd (w) ta ( ) 0.68w 85 standard rohm board capacity value of ceramic capacitor - dc bias characteristics example -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 00.511.522.533.54 dc bias voltage [v] capacitance change [%] 10-v withstand voltag e b1char acter istics grm 188b11a105ka61d 10-v withstand voltag e b char acter istics 6.3- v withstand voltag e b char acter istics 4-v withstand voltag e x6s characteristics 10-v withstand voltag e f char acter istics 10- v withstand voltag e f char acter istics * please design the margin so that pmax becomes is than pd (pmax < pd) within the usage temperature range figure 13.hvsof6 power dissipation heat reduction characteristics (reference) . . 5 5 5 op crreio[a] e [] stable region cout=1.0 f,cin=1.0 f, te m p = + 2 5 figure 12. stable region (example) figure 11. capacity-bias characteristics downloaded from: http:///
datasheet datasheet 8/10 tsz02201-0rbr0a300170-1-2 ? 2012 rohm co., ltd. all rights reserved. 25.sep.2013 rev.001 www.rohm.com tsz22111 ? 15 ? 001 bhxxma3 series operational notes 1) absolute maximum ratings this product is produced with strict quality control, however it may be destroyed if operated beyond its absolute maximum ratings. in addition, it is impossible to predict a ll destructive situations such as short-circuit modes, open circuit modes, etc. therefore, it is important to consider circuit protection measures, like adding a fuse, in case the ic is operated in a special mode exceeding the absolute maximum ratings. 2) gnd potential gnd potential must be the lo west potential of all pins of the ic at all o perating conditions. ensure that no pins are at a voltage below the ground pin at any ti me, even during transient condition. 3) setting of heat carry out the heat design that have adequate marg in considering pd of actual working states. 4) pin short and mistake fitting when mounting the ic on the pcb, pay attention to the orientat ion of the ic. if there is mistake in the placement, the ic may be burned up. 5) actions in strong magnetic field using the ic within a strong magnetic field may cause the ic to malfunction. 6) mutual impedance use short and wide wiring tracks for the power supply and ground to keep the mutual impedance as small as possible. use a capacitor to keep ripple to a minimum. 7) stby pin voltage for standby mode, set stby voltage below 0.3v. for normal operation, set the pin voltage beyond 1.5v. it is not recommended to set stby voltage between 0.3v and 1.5v, as it may cause malfunctions. 8) over current protection circuit over current and short circuit protection is built-in at the output, and ic destruc tion is prevented at the time of load short circuit. these protection circuits are effective in the destructive prevention by the sudden accident. please avoid applications where the over current protection circuit operates continuously. 9) thermal shutdown this ic also features a thermal shutdown circuit that is designed to turn off t he output when the juncti on temperature of the ic exceeds about 170 . this feature is intended to protect the ic on ly in the event of thermal overload and is not designed to guarantee operation or act as an active securi ty device for applications. therefore, it is not recommended that you design application where tsd will work in normal condition. tsd on tempurature( ) (typ.) hysteresis tempurature( ) (typ. bhxxma3 series 170 15 10) noise pin noise pin can drive small current, since it is directly connected to reference voltage circuit. the output voltage may drop when the load of noise pin is more than 100na. if the pin is connected to a capacitor, please use ceramic capacitor for small leak current. please take note that the output noise is smaller as noise pin capacitor is larger, but startup time is longer. 11)output capacitor to prevent oscillation at output, it is recommended that t he ic be operated at the stable region shown in figure 12. it operates at the capacitanc e value of more than 1.0 f. as capacitance is larger, stability becomes more stable and characteristic of output load fluctuation is also improved. downloaded from: http:///
datasheet datasheet 9/10 tsz02201-0rbr0a300170-1-2 ? 2012 rohm co., ltd. all rights reserved. 25.sep.2013 rev.001 www.rohm.com tsz22111 ? 15 ? 001 bhxxma3 series ordering information physical dimension tape and reel information marking diagram(s) (unit : mm) hvsof6 0.1 s s (1.2)(1.4) (1.5) (0.45) (0.15) 0.145 0.05 0.22 0.05 0.75max. 0.5 321 456 3.0 0.1 2.6 0.1 1.6 0.1 (max 1.8 include burr) (max 2.8 include burr) direction of feed reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper right when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs tr () 1pin hvsof6(top view) part number marking lot numbe r 1pin mark packaging and forming specifications tr:embossed tape and reel tr rohm part no. output voltage xx=15:1.5v xx= 18:1.8v xx= 25:2.5v xx= 28:2.8v xx= 29:2.9v xx= 30:3.0v xx= 31:3.1v xx= 33:3.3v series name ma3:300ma shutdown switch w:with switch package hfv:hvsof6 3w h f v - bhx xma xx output voltage marking 15 1.5v typ. cb 18 1.8v typ. cc 25 2.5v typ. cd 28 2.8v typ. ce 29 2.9v typ. cf 30 3.0v typ. cg 31 3.1v typ. ch 33 3.3v typ. cj downloaded from: http:///
datasheet datasheet 10/10 tsz02201-0rbr0a300170-1-2 ? 2012 rohm co., ltd. all rights reserved. 25.sep.2013 rev.001 www.rohm.com tsz22111 ? 15 ? 001 bhxxma3 series revision history date revision changes 25.sep.2013 001 new release downloaded from: http:///
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice - ge rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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